IEEE - Institute of Electrical and Electronics Engineers, Inc. - Efficient heterogeneous three-dimensional packaging at a system level
16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings
Author(s): | Lyke, J. |
Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
Publication Date: | 1 January 1997 |
Conference Location: | Irvine, CA, USA, USA |
Conference Date: | 30 October 1997 |
Volume: | 1 |
Page(s): | 2 - 13 |
ISBN (Paper): | 0-7803-4150-3 |
DOI: | 10.1109/DASC.1997.635038 |
Regular:
While a proliferation of approaches have been proposed for three-dimensional packaging, a basic dichotimization between short stacks of regular (low-complexity) iterated assemblies and... View More