IEEE - Institute of Electrical and Electronics Engineers, Inc. - Efficient heterogeneous three-dimensional packaging at a system level

16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings

Author(s): Lyke, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Irvine, CA, USA, USA
Conference Date: 30 October 1997
Volume: 1
Page(s): 2 - 13
ISBN (Paper): 0-7803-4150-3
DOI: 10.1109/DASC.1997.635038
Regular:

While a proliferation of approaches have been proposed for three-dimensional packaging, a basic dichotimization between short stacks of regular (low-complexity) iterated assemblies and... View More

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