IEEE - Institute of Electrical and Electronics Engineers, Inc. - Towards an ultra-high density interconnect (UHDI) technology

16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings

Author(s): Krishnamurthy, V. ; Rose, J. ; Saia, R. ; Durocher, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Irvine, CA, USA, USA
Conference Date: 30 October 1997
Volume: 1
Page(s): 2 - 8
ISBN (Paper): 0-7803-4150-3
DOI: 10.1109/DASC.1997.635037
Regular:

We present a plastic based 3-D MCM technology with a path for achieving ultra-high densities with abroad array of applications. This path has been chosen as a means for realizing novel next... View More

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