IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and development of high capacity spaceborn memory modules in the high density interconnect (HDI) technology for the tropical rainfall measuring mission (TRMM)

16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings

Author(s): McCabe, J. ; Dalton, D. ; Lyke, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Irvine, CA, USA, USA
Conference Date: 30 October 1997
Volume: 1
Page(s): 2 - 24
ISBN (Paper): 0-7803-4150-3
DOI: 10.1109/DASC.1997.635035
Regular:

A new technology, a planar multi chip module (MCM) employing thin film polyimide/Cu-Ti interconnects was designed, fabricated and successfully inserted into the Tropical Rainfall Measuring Mission... View More

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