IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and fabrication of a tri-C30 multichip module building block

16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings

Author(s): Staggs, J. ; Smith, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Irvine, CA, USA, USA
Conference Date: 30 October 1997
Volume: 1
Page(s): 2 - 23
ISBN (Paper): 0-7803-4150-3
DOI: 10.1109/DASC.1997.635028
Regular:

A real-time architecture was designed, developed and fabricated that targets an application through the MiP (Monolithic Interceptor Processor) program. This MCM, as an elemental building block for... View More

Advertisement