IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fast and flexible development of multichip modules for space and other high-reliability applications

16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings

Author(s): Banker, J. ; Buckingham, J. ; Caffrey, R. ; Garrison, A. ; Shaw, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Irvine, CA, USA, USA
Conference Date: 30 October 1997
Volume: 1
Page(s): 2 - 1
ISBN (Paper): 0-7803-4150-3
DOI: 10.1109/DASC.1997.635025
Regular:

Pico Systems, Inc. And NASA-Goddard Space Flight Center have been working together to determine the viability of Pico's programmable multichip module (MCM) substrate for use in space and high... View More

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