IEEE - Institute of Electrical and Electronics Engineers, Inc. - Generating reduced order models via PEEC for capturing skin and proximity effects

Electrical Performance of Electronic Packaging

Author(s): Kamon, M. ; Marques, N. ; Silveira, L.M. ; White, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 259 - 262
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634084
Regular:

In the past, model order reduction techniques have been successfully employed for 3-D PEEC (Partial Element Equivalent Circuit) interconnect models. This paper explores the difficulties in... View More

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