IEEE - Institute of Electrical and Electronics Engineers, Inc. - Rapid electromagnetic analysis of multilayer interconnects

Electrical Performance of Electronic Packaging

Author(s): Heckmann, D. ; Dvorak, S.L. ; Cangellaris, A.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 232 - 235
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634078
Regular:

In this paper, a closed-form solution is presented for the individual elements of the impedance matrix generated by the application of the Method of Moments to the integral equation solution of... View More

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