IEEE - Institute of Electrical and Electronics Engineers, Inc. - Circuit modeling of isolation in flip-chip microwave integrated circuits

Electrical Performance of Electronic Packaging

Author(s): Ito, R. ; Jackson, R.W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 217 - 220
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634074
Regular:

A circuit model for multi-port flipped-chip packaging of microwave integrated circuits is described. The model topology includes the effect of non-ideal isolation between IC ports and predicts... View More

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