IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel broadband flip chip interconnection
Electrical Performance of Electronic Packaging
| Author(s): | Kim, J. ; Koh, D. ; Itoh, T. |
| Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
| Publication Date: | 1 January 1997 |
| Conference Location: | San Jose, CA, USA, USA |
| Conference Date: | 27 October 1997 |
| Page(s): | 199 - 202 |
| ISBN (Paper): | 0-7803-8649-3 |
| DOI: | 10.1109/EPEP.1997.634070 |
Regular:
Flip chip interconnections with CPW structures are studied. A novel broadband flip chip interconnection design is proposed based on the results of the sensitivity analysis performed by the Finite... View More
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