IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulation of large packaged dense microwave circuits

Electrical Performance of Electronic Packaging

Author(s): Petre, P. ; Valley, G.C. ; Kihm, R.T. ; Gedney, S.D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 191 - 194
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634068
Regular:

A new fast method of moments code is used to predict the performance and calculate the electromagnetic properties of packaged, dense, planar microwave circuits. It is demonstrated that circuits as... View More

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