IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measurement and field simulation based characterization of plastic IC packages

Electrical Performance of Electronic Packaging

Author(s): Mernyei, F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 181 - 184
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634066
Regular:

A method to obtain electrical models for IC packages is introduced. We used measured S-parameters to extract equivalent circuits for the package and surrounding components. The resulted equivalent... View More

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