IEEE - Institute of Electrical and Electronics Engineers, Inc. - Accurate de-embedding of the contribution of the test boards to the high-frequency characteristics of backplane connectors

Electrical Performance of Electronic Packaging

Author(s): Sercu, S. ; Martens, L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 177 - 180
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634065
Regular:

This paper investigates the determination of the intrinsic high-frequency characteristics of a multi-pin backplane connector. The intrinsic characteristics are the characteristics (S-parameters)... View More

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