IEEE - Institute of Electrical and Electronics Engineers, Inc. - Accurate characterization of board level interconnects for high performance systems

Electrical Performance of Electronic Packaging

Author(s): Lutz, R.D. ; Tripathi, A. ; Tripathi, V.K. ; Arabi, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 171 - 174
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634064
Regular:

Calibration and de-embedding techniques for time domain measurements associated with high speed off chip digital interconnects are presented. The techniques are demonstrated by measurements of... View More

Advertisement