IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of heat spreader on electrical characteristics of tape-BGA packages

Electrical Performance of Electronic Packaging

Author(s): Hasan, H. ; Cangellaris, A. ; Kaw, R. ; Pinello, W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 153 - 156
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634060
Regular:

Heat spreader is an integral part of a high speed integrated circuit (IC) package. It affects electrical characteristics of interconnects and the radiation behavior of a given package. This paper... View More

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