IEEE - Institute of Electrical and Electronics Engineers, Inc. - Adjacent line coupling for long off chip interconnects

Electrical Performance of Electronic Packaging

Author(s): Harrer, H. ; Kaller, D. ; Klink, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 139 - 141
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634057
Regular:

The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling... View More

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