IEEE - Institute of Electrical and Electronics Engineers, Inc. - Significance of electromagnetic coupling through vias in electronics packaging
Electrical Performance of Electronic Packaging
Author(s): | Jin Zhao ; Jiayuan Fang |
Publisher: | IEEE - Institute of Electrical and Electronics Engineers, Inc. |
Publication Date: | 1 January 1997 |
Conference Location: | San Jose, CA, USA, USA |
Conference Date: | 27 October 1997 |
Page(s): | 135 - 138 |
ISBN (Paper): | 0-7803-8649-3 |
DOI: | 10.1109/EPEP.1997.634056 |
Regular:
The investigation on the relative significance of electromagnetic coupling between vias and parallel traces is presented in this paper. This study shows that the coupling between vias can often be... View More