IEEE - Institute of Electrical and Electronics Engineers, Inc. - Significance of electromagnetic coupling through vias in electronics packaging

Electrical Performance of Electronic Packaging

Author(s): Jin Zhao ; Jiayuan Fang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 135 - 138
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634056
Regular:

The investigation on the relative significance of electromagnetic coupling between vias and parallel traces is presented in this paper. This study shows that the coupling between vias can often be... View More

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