IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization, modeling and optimization of high power module packaging

Electrical Performance of Electronic Packaging

Author(s): Trivedi, M. ; Shenai, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 103 - 106
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634049
Regular:

This paper reports the use of two-dimensional numerical simulations in modeling the effects of packaging on the electrical performance of high-power modules. Non-isothermal simulations are... View More

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