IEEE - Institute of Electrical and Electronics Engineers, Inc. - A new flip-chip mounting technique for high temperature operation

Electrical Performance of Electronic Packaging

Author(s): Basu, A. ; Itoh, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 95 - 98
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634047
Regular:

A new method is described for mounting microwave semiconductor devices on a circuit board in a flip-chip configuration, which overcomes the limitations on the maximum temperature of operation... View More

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