IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wideband crosstalk analysis of coupled bondwires buried in high-speed plastic packages

Electrical Performance of Electronic Packaging

Author(s): Sang-Ki Yun ; Hai-Young Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 91 - 94
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634046
Regular:

Crosstalk of picosecond pulses in bondwires for plastic packaging is analyzed using the full-wave method of moments (MoM) and the FFT algorithm, showing that the static crosstalk model of SPICE is... View More

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