IEEE - Institute of Electrical and Electronics Engineers, Inc. - Packaging and interconnect design and analysis using FDTD

Electrical Performance of Electronic Packaging

Author(s): Piket-May, M. ; Thomas, K. ; Gravrok, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 87 - 90
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634045
Regular:

This paper presents information about the development of a versatile FDTD solver and explores design issues relevant to the packaging and interconnect design engineers. The EM analysis development... View More

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