IEEE - Institute of Electrical and Electronics Engineers, Inc. - The enhancement of static simulator package characterization through conductor segmentation

Electrical Performance of Electronic Packaging

Author(s): Klemens, G. ; Aparin, V. ; Gard, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 79 - 82
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634043
Regular:

A technique is presented for increasing the accuracy of package models produced by static simulation through segmentation of conductors. The lumped circuit elements are better distributed along... View More

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