IEEE - Institute of Electrical and Electronics Engineers, Inc. - A hierarchical power supply distribution model for full-chip switching noise analysis

Electrical Performance of Electronic Packaging

Author(s): Chen, H.H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 60 - 63
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634039
Regular:

This paper describes the use of a 12/spl times/12 SCM power supply distribution model, a 50/spl times/50 on-chip power bus model, and a distributed switching circuit model to analyze the on-chip... View More

Advertisement