IEEE - Institute of Electrical and Electronics Engineers, Inc. - Experimental electrical characterization of on-chip interconnects

Electrical Performance of Electronic Packaging

Author(s): Biswas, B. ; Glasser, A. ; Lipa, S. ; Steer, M. ; Franzon, P. ; Griffis, D. ; Russell, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 57 - 59
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634038
Regular:

This paper describes the transmission line and capacitance measurements made on a 0.25 micron test chip. Transmission lines were characterized to frequencies up to 20 GHz using a Hewlett Packard... View More

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