IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations

Electrical Performance of Electronic Packaging

Author(s): Koike, S. ; Kaizu, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: San Jose, CA, USA, USA
Conference Date: 27 October 1997
Page(s): 35 - 38
ISBN (Paper): 0-7803-8649-3
DOI: 10.1109/EPEP.1997.634033
Regular:

A low-cost technique for reducing simultaneous switching noise in a sub-board packaging configuration has been developed. By using a thin insulator film made of conventional FR4 substrate... View More

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