IEEE - Institute of Electrical and Electronics Engineers, Inc. - High performance heatsinks for processors and power electronics: Beyond extrusions

WESCON/97 Conference Proceedings

Author(s): Copeland, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Santa Clara, CA, USA
Conference Date: 6 November 1997
Page(s): 146 - 149
ISBN (Paper): 0-7803-4303-4
ISSN (Paper): 1095-791X
DOI: 10.1109/WESCON.1997.632330
Regular:

Forced air cooling of high density electronics has begun to reach space and weight limits beyond the performance capabilities of standard extrusions. Though extrusions are improving, other... View More

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