IEEE - Institute of Electrical and Electronics Engineers, Inc. - Shielded high performance interconnect technology dramatically increases real signal density

WESCON/97 Conference Proceedings

Author(s): Cohen, T. ; Patel, G.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Santa Clara, CA, USA
Conference Date: 6 November 1997
Page(s): 140 - 145
ISBN (Paper): 0-7803-4303-4
ISSN (Paper): 1095-791X
DOI: 10.1109/WESCON.1997.632329
Regular:

Teradyne has developed a highspeed, high-density board-to-board interconnect, called VHDM, which will meet most industry needs with respect to mechanical and electrical characteristics. An... View More

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