IEEE - Institute of Electrical and Electronics Engineers, Inc. - New Packaging Method of Field Emission Display using Silicon-to-ITO coated glass Bonding

Author(s): Jee-Won Jeong ; Byeong-Kwon Ju ; Woo-Beom Choi ; Leel, D. ; Yun-Hi Lee ; Nam-Yang Lee ; Seong-Jae Jung ; Doo-Jin Choi ; Myung-Hwan Oh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Kyongju, Korea, Korea
Conference Date: 17 August 1997
Page(s): 711 - 715
ISBN (Paper): 0-7803-3786-7
DOI: 10.1109/IVMC.1997.627682
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