IEEE - Institute of Electrical and Electronics Engineers, Inc. - Localized electrochemical plating of interconnectors for microelectronics

IEEE WESCANEX 97 Communications, Power and Computing. Conference Proceedings

Author(s): El-Giar, E.M. ; Thomson, D.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Winnipeg, Manitoba, Canada, Canada
Conference Date: 22 May 1997
Page(s): 327 - 332
ISBN (Paper): 0-7803-4147-3
DOI: 10.1109/WESCAN.1997.627162
Regular:

This work demonstrates the electrodeposition of micrometer scale copper structures including columns and interconnectors. Copper interconnectors of 25 /spl mu/m width were grown within an... View More

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