IEEE - Institute of Electrical and Electronics Engineers, Inc. - High pin count BGA board level assembly

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Mendez, D.M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 452 - 456
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626962
Regular:

Successful processing of high pin count Ball Grid Array (BGA) components through an assembly operation is dependant upon many factors including solder paste deposition, component placement, and... View More

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