IEEE - Institute of Electrical and Electronics Engineers, Inc. - CSP solder ball reliability

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Ikemizu, M. ; Fukuzawa, Y. ; Nakano, J. ; Yokoi, T. ; Miyajima, K. ; Funakura, H. ; Hosomi, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 447 - 451
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626961
Regular:

The solder joint reliability for Chip Scale Package (CSP) as assembled on Printed Circuit Board (PCB) is believed to be poorer than that for QFP. The main cause of this poor reliability is the... View More

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