IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of substrate warpage on the second level assembly of advanced plastic ball grid array (PBGA) packages

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Bhogeswara Rao, D. ; Prakash, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 439 - 446
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626959
Regular:

Shadow Moire technique was used to study the out-of-plane displacements that represent warpage of advanced Plastic Ball Grid Array (PBGA) packages. Two types of PBGA packages, die-up and... View More

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