IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal enhancement and reliability of 40 mm EPBGA packages with interface materials

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Celik, Z.Z. ; Copeland, D. ; Mertol, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 376 - 385
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626948
Regular:

Increasing power requirements for Plastic Ball Grid Array (PBGA) packages demand better thermal management for increased performance and reliability. One of the important parameters that affect... View More

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