IEEE - Institute of Electrical and Electronics Engineers, Inc. - High performance ball grid array utilizing flip chip bonding on buildup printed circuit board

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Yamanaka, K. ; Mori, H. ; Tsukada, Y.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 369 - 375
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626947
Regular:

A flip chip bonding on a buildup Printed Circuit Board (PCB) has been emerging in a chip carrier area. As chip performance has been improving rapidly, it is now required to have a high performance... View More

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