IEEE - Institute of Electrical and Electronics Engineers, Inc. - Moisture absorption and autoclave performance optimization of glob top ball grid array

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Thompson, T.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 362 - 368
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626946
Regular:

The glob top BGA has been pursued by multiple companies to reduce package cost and cycle time. This report discusses material and process improvements that can be made to enhance the packages'... View More

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