IEEE - Institute of Electrical and Electronics Engineers, Inc. - Eutectic solder bumped flip chip development

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Akashi, T. ; Chikai, T. ; Hamano, T. ; Yoshida, A. ; Honma, S. ; Aoki, H. ; Miyata, M. ; Ezawa, K. ; Makita, T. ; Miyaoka, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 319 - 325
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626938
Regular:

Recently, smaller, thinner and higher density packaging technology is demanded. Flip chip interconnection is one of solution to these demands. We have developed solder bumping and wafer sorting... View More

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