IEEE - Institute of Electrical and Electronics Engineers, Inc. - Adhesive flip chip assembly using plated bump chips

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Riley, G.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 313 - 318
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626937
Regular:

While research on adhesive flip chip interconnection is growing rapidly, there has been little information available about how to apply this research to making practical adhesive flip chip... View More

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