IEEE - Institute of Electrical and Electronics Engineers, Inc. - Silicon device pad design considerations for solder flip chip applications

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Kubin, R. ; Ho, V.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 308 - 312
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626936
Regular:

As the use of solder flip chip devices increases, it is important to ensure that the design and materials used in the die to solder bump structure are compatible with one another and provide a... View More

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