IEEE - Institute of Electrical and Electronics Engineers, Inc. - High reliability assembly of chip scale packages

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Partridge, J.P. ; Hart, C. ; Boysan, P. ; Surratt, B. ; Foehringer, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 274 - 283
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626930
Regular:

Ball Grid Array (BGA) packages with 1.27 mm pitch arrays are now being extended to fine pitch BGAs, or Chip Scale Packages (CSP) with ball diameters of 0.3 mm and array pitches as small as 0.5 mm.... View More

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