IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cost considerations for integrating flip chip and chip on board technologies into high volume manufacturing areas

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Roney, R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 269 - 273
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626929
Regular:

As die mount assembly begins to enter the high volume surface mount assembly mainstream and electronics designers and engineers begin serious discussions about converting surface mount designs to... View More

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