IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cost issues for chip scale packaging

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Singer, A.T. ; Wzorek, J.F.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 224 - 228
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626922
Regular:

The IC industry amounted to $140 billion worldwide in 1996. As the consumer and portable electronics portion of this market grows, so will. The demand for component packaging that meets higher... View More

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