IEEE - Institute of Electrical and Electronics Engineers, Inc. - New chip scale package with CTE matching to the board

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Schueller, R.D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 205 - 215
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626909
Regular:

This paper outlines a few of the more promising chip scale package configurations and discusses where they stand with respect to some of the ideal requirements for a CSP. These criteria are: low... View More

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