IEEE - Institute of Electrical and Electronics Engineers, Inc. - Heel cracking induced by the steep conversion of EMC in large QFP

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Lee, Y.M. ; Cho, J.H. ; Sun, Y.B. ; Kim, N.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 201 - 204
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626906
Regular:

Bonding wire heel crack observed in large QFP was studied. From the analysis, it was found that this type of open failure was caused by heel crack at stitch bond during molding. The mold... View More

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