IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thick-film intelligent sensors using new Du Pont and ESL high technology materials

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Fitt, J. ; Gondek, J.J. ; Parzelka, Z. ; Zaraska, W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 196 - 200
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626904
Regular:

The paper presents the design and technology of production of thick-film intelligent sensors (TF-ASIC), their characteristics and applications. The novel hybrid sensors and application specific... View More

Advertisement