IEEE - Institute of Electrical and Electronics Engineers, Inc. - A new test technology for package, module and PCB interconnects

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Flake, R.H. ; Sugoog Shon ; Wong, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 160 - 164
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626893
Regular:

This paper discusses an application of a new testing method, Thermal Transmission line Testing (T/sup 3/) for dense packaging interconnects based on measurements of transient thermal signatures... View More

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