IEEE - Institute of Electrical and Electronics Engineers, Inc. - A realtime process control system for solder paste stencil printing

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Venkateswaran, S. ; Srihari, K. ; Adriance, J.H. ; Westby, G.R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 62 - 67
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626877
Regular:

The goal of stencil printing solder paste in surface mount printed circuit board (PCB) assembly is to apply an accurate and repeatable volume of solder paste at precise locations. The causes for a... View More

Advertisement