IEEE - Institute of Electrical and Electronics Engineers, Inc. - An experimental study on organic solderability preservative

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Yuan Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 56 - 61
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626876
Regular:

Organic solderability preservatives (OSP) are regarded as an excellent pad finish for fine pitch SMT because they can produce a very thin and even coating. However, OSP coatings are more... View More

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