IEEE - Institute of Electrical and Electronics Engineers, Inc. - Assembly and reliability of thermally enhanced high I/O BGA packages

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Ejim, T.I. ; Hollesen, D.B. ; Holliday, A. ; Gahr, S.A. ; Coyle, R.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 25 - 31
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626868
Regular:

Surface mount assembly defects for thermally enhanced high I/O, BGAs can range from 0 to 20 ppmj with packages that meet the JEDEC coplanarity specification of 6 mils. Defect levels can be much... View More

Advertisement