IEEE - Institute of Electrical and Electronics Engineers, Inc. - Assessment of failure rate of printed board assemblies by the high temperature accelerated life test

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

Author(s): Choong-Reol Young ; Jae-Nyun Yoo
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1997
Conference Location: Austin, TX, USA
Conference Date: 13 October 1997
Page(s): 1 - 5
ISBN (Paper): 0-7803-3929-0
ISSN (Paper): 1089-8190
DOI: 10.1109/IEMT.1997.626864
Regular:

In this paper, we summarize the work in the field of assessing the reliability of printed board assemblies of a switching system, applying the method of the high temperature accelerated life-test.... View More

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