IEEE - Institute of Electrical and Electronics Engineers, Inc. - Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC

IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium. Digest of Papers

Author(s): Tokumitsu, T. ; Nishikawa, K. ; Kamogawa, K. ; Toyoda, I. ; Aikawa, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1996
Conference Location: San Francisco, CA, USA, USA
Conference Date: 17 June 1996
Page(s): 85 - 88
ISBN (Paper): 0-7803-3360-8
DOI: 10.1109/MCS.1996.506309
Regular:

We first verified that the integration level of multifunction MMICs can be easily increased three-fold by using three-dimensional (3-D) MMIC structure, in comparison to planar ones. The technology... View More

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