IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

Proceedings of IEEE Multi-Chip Module Conference (MCMC-93)

Author(s): Iqbal, A. ; Swaminathan, M. ; Nealon, M. ; Omer, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Santa Cruz, CA, USA, USA
Conference Date: 15 May 1993
Page(s): 12 - 17
ISBN (Paper): 0-8186-3540-1
DOI: 10.1109/MCMC.1993.302159
Regular:

Design tradeoffs in electrical performance, wiring density and cost for MCM-C, MCM-D and MCM-D/C technologies are described. MCM-C includes cofired alumina (AlO) substate using molybdenum... View More

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